论文

代表性论文

1.  Encyclopedia of packaging materials, processes and mechanics, Set interconnect and wafer bonding technology, vol 1: flip-chip and underfill materials and technology, Pengli Zhu, Gang Li, Ching ping Wong, World Scientific Publishing Co.Pte. Ltd. 2019  Singapore

2.  Materials for Advanced Packaging, chapter 8, Flip-Chip Underfill: Materials, Process, and Reliability, Zhuqing Zhang, Pengli Zhu, and C.P. Wong. 2018 Springer International Publishing Switzerland 2009, 20161118日出版

3.  Xianwen Liang,Tao Zhao,Wen Jiang,Xuecheng Yu, Yougen Hu, Pengli Zhu*, Hairong Zheng, Rong Sun, Ching-Ping Wong, Highly Transparent Triboelectric Nanogenerator Utilizing in-situ Chemically Welded Silver Nanowire Network as Electrode for Mechanical Energy Harvesting and Body Motion Monitoring, Nano Energy, 2019, 59, 508-516

4.  Gang Li,TaoZhao,Pengli Zhu*, Yachuan He, Rong Sun, Daoqiang Lu, Ching-pingWong, Structure-property relationships between microscopic filler surface chemistry and macroscopic rheological,thermal-mechanical, and adhesive performance of SiO2 filled nanocomposite underfills,Composites Part A: Applied Science and Manufacturing 2019,118,223-234.

5.  Yu Zhang#, Pengli Zhu#*, Gang Li, Tao Zhao, Xianzhu Fu, Rong Sun, Feng Zhou, Ching-ping Wong, Facile preparation of monodisperse, impurity-free and anti-oxidation copper nanoparticles in large scale for application in conductive ink, ACS Applied Materials & Interfaces, 2014, 6 (1),560-567.


代表性专利

1.孙蓉,张昱,朱朋莉,李刚,铜基导电浆料及其制备与其在芯片封装铜铜键合中的应用,授权号:CN106205772B

2.李刚, 朱朋莉, 赵涛, 孙蓉, 底部填充胶及其制备方法;ZL201510326082.3 

3.孙蓉,朱朋莉,李刚,赵涛,一种高介电环氧塑封料及其制备方法和应用;201610657326.0

4.孙蓉, 郭倩, 朱朋莉, 赵涛, 李刚, 二氧化硅填料、二氧化硅填料的表面处理方法及环氧树脂复合材料,日本,PCT/ZL2016/078815

5.孙蓉, 韩延康,赵涛,张保坦,朱朋莉,胡友根,一种掺杂银纳米颗粒的导电银胶及其制备方法与应用,授权号:CN106118539B